2021-10-13-德勤-不确定下的曙光——亚太半导体腾飞(英文版)_48页_4mb
报告摘要
Report Summary: Asia Pacific Takes Off - Anchor of Global Semiconductor
The report analyzes the global semiconductor industry, focusing on the role and changes in the Asia Pacific region. The semiconductor industry has evolved from consumer-driven demand to a dual driver model incorporating corporate needs, which is essential for future technologies like AI and 5G. Asia Pacific is becoming the cornerstone of global semiconductor development due to its leading manufacturers, materials, and design capabilities.
Taiwan (China), Japan, South Korea, and Mainland China collectively produce a significant portion of the world's semiconductors. By 2030, Asia Pacific's market share in the global semiconductor industry is projected to reach 62%, with the global market value expected to exceed US$1 trillion. Samsung and TSMC dominate manufacturing, contributing over 70% of the market, while Japanese companies lead in materials, accounting for more than 50% of the global market.
The industry faces challenges such as supply chain vulnerabilities and talent shortages, exacerbated by black swan events like the COVID-19 pandemic and geopolitical tensions. However, innovation in AI-driven manufacturing—cutting down time-to-market and improving yield—promises substantial growth. China is investing aggressively with its 14th Five-Year Plan, focusing on self-sufficiency and R&D, but still has gaps in high-end chips.
Key changes include shifts toward automotive semiconductors, especially in electric vehicles (EVs) and intelligent driving systems, where power semiconductors (like SiC) and advanced sensors are critical. Supply chain diversification and regional ecosystem development are crucial for sustained growth. The industry's future depends heavily on R&D investment, collaborations, and addressing talent and supply chain risks.
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